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LM liquid thermal compounf is the latest generation of thermal interfaces. LM compound does not contain non-metallic additives such as silicones or metal oxides. This high purity allows greatly increased thermal transfer compared to standard compounds. LM liquid metal compound is made from 100% liquid metal and is produced in a highly advanced production and developement process made for the highest requirements. Dwarfing all converntional thermal compounds and featuring easy application in combination with a thermal conductivity increased ten-fold over conventional compound, this is the ultimate thermal transfer solution. A multitude of tests and user reviews have shown that liquid metal thermal compounds leave all conventional thermal compounds (known to us) far behind in the dust. Important LM liquid metal thermal compound is not suitable for use on Aluminium surfaces. Comparison (see image gallery) CPU temperatues can be loswered from approx. 50°C to 44°C - an improvement by 6°C! Extent of delivery Syringe with dosing top for finest application and cap Gross weight approx. 3.7g Sufficient for multiple applications Please note the following points LM liquid thermal compound is currently the best thermal interface for electronic components. It can be used on CPU, GPU and other components, providiing an improved cooling performance by approx. 3°C to 7°C compared to conventional thermal compounds. LM compound was developed for high-end cooling applications and must only be applied to contact surfaces such as Copper, Nickel, Silver or Gold. It must not be applied to Aluminium surfaces! IMPORTANT LM compond is electrically conductive, hence all contact with conductor paths must be avioded. Being applied to the cooling surface, this conductivity is no hazard, as both contact surface (e.g. heatspreader or DIE) and heatsink themself are already electrically conductive.