Innovative Sensor Technology-MFS 02 confected by bonding process on PCB MFS02.PEXP.0, 34.4 x 10.8 x 1 mm (Pack of 10)

Description

Substrate: glass Tolerance: Temperatur Sensor (Pad 1-8): 800 Ohm +/-10% R1 (Pad 2-3): 720 Ohm +/- 10% R2 (Pad 3-4): 720 Ohm R3 (Pad 5-6): 530 Ohm +/- 10% R4 (Pad 6-7): 530 Ohm Matching between elements (R1 & R2 and acc. R3 & R4): 2% TCR: 3670ppm/K +/- 80ppm/K Resistivity at T=0°C Chip-Dimension: 3.5 x 5.1 x 0.5 mm (LxWxH) PCB-dimension: 34.4 x 10.8 x 1 mm (LxWxH) PCB 4 mm shorter milled and discharged Sensor Contacts: bonding pads Note: Temperatur Sensor not at the level of the membrane (redesign) Special: Sensors contacted by bonding process of PCB PCB- Layout: V1.0