A Practical Guide to RF and Mixed Technology Printed Circuit Board Layout

Things I liked:Short to-the-point chapters, detailed graphic design, It is actually practical, lots of insightful information.Things I didn't like:Chapter "On The Right Wavelength" website URL doesn't exist.Chapter "Processes and Cost" misses lamination cycles as a major cost factor. I would've appreciated more discussion on cost association per via type and various HDI stackups, etc. The factors it does list are well known.Chapter "Useful RF and Mixed Technology Stackups" has stackups that result in asymmetrical sub-laminations. The stackup on pg. 76 has blind via dividing the stack into a 5 layer on top and 11 layer on bottom. Be careful with these stackups, the typical manufacture of this stackup would be a single lamination with back-drilling, which isn't specified.