smartfly info NEO/NEO2/NEO2 Black Metal Case w/Heat Sink

Just a brief summary. This case is inexpensive, looks nice, and fits the NanoPi Neo that I had lying around. It is a nice snug fit and the Neo seems to transfer heat off to the heatsink ok.The one potential downside is that included heatsink is definitely thinner and has less mass than the original heatsink that you can order with the NanoPi Neo. So I don't expect it to soak up as much heat but all in all if you are running the right kernel, the OS should throttle if it hits thermal limits. I think I remember Armbian had that enabled. For what you get this is well worth the price and it's nice to have the board protected.Overall it's a really professional looking enclosure for a super affordable price.

It is a very nice case a lot better than a printer 3D printer did.But it's not a real good fit the board can move back and forth in the case a little can like hole the ethernet cable and move the case back and forth and hear the board with a little ring sound of the case.I guess could file off some of the side of the case to make it fit better. But it should come like this.-Raymond Day

I was looking for a NanoPi NEO case that wouldn’t take a month to arrive and found this. If I could do it over again, I’d have bitten the bullet and just ordered from the manufacturer overseas.The heat sink juts about 1/16” past the edge of the case, but the screw holes on it put the board a little too far inside. As a result, the only way I can use it is to leave off one of the ends of the case. At some point I’m going to shave down the overhanging part with a rotary tool, but for now I’m just going to live with it as is.

Prior to purchasing this board, I had seen other reviews describing poor mechanical fit issues with boards using this form factor. My needs were less critical for precision fit, so I took a chance on it. I'm glad I did because I wanted a reasonably priced metal case to house the Youyeetoo flavor of the NanoPI NEO 512M board. I received this case and mounted the NEO board on it. I removed the heat 'pad' cover tape, which provides adequate mating mechanical contact to the H3 SoC chip. I have not extensively tested the effectiveness of this heat dissipation system, but the board continues to run at respectably cool temperatures in the household environment it is currently operating in. I found no problems with mechanical alignment or tolerances lining up to where the ports are installed on the case I received. If I was going to nit-pick, I would say that there might be 0.25 mm too much length in the case, as the power micro-USB connector is very slightly recessed with the end plates installed. This is not enough to prevent reliably connecting power to my board with common micro-USB connectors on-hand. Based on this experience, I am likely to select this board and case again for a couple of projects that will be installed in an unconditioned radio shack up on a mountain top using GPIO pins to control two-way radio repeaters as well as the on-board sound chip with customized software to add RoIP / VoIP capabilities to these systems. Temperatures in this equipment shack are likely to range from -5 deg F on the coldest nights to as high as 100 deg F on the hottest summer day. The heat sink functionality will not really be tested until I build the target state equipment. For general home use the heat sink and pad arrangement is at least adequate with overall fit precision and build quality exceeding my expectations.